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Thermal Analysis of Heat Sink in CPU with Varying Fin Designs

Authors(2):

P. Ravichandran, L. C. Gokul
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Due to the passage of current, the electronic components generate heat during the course of their operation. The main objective is to cool the electronic component by removing the heat generated in order to ensure the optimal working of the component. This is done by attaching fins to the device which aid in rapid heat removal to the surroundings. Heat sinks using thermal contact absorb and disperse heat. Heat sinks function efficiently by transferring thermal energy from an object at a relatively high temperature to another object at a lower temperature with greater heat capacity. This rapid transfer of thermal energy quickly makes both the object at equilibrium state by lowering the temperature of the first object, fulfilling the heat sink's role as a cooling device. A computer system's components produce large amounts of heat during their operation. Integrated circuits include CPUs, chipset and graphics cards along with hard drives produce large amount of heat. In order to keep these components in safe condition, heat generated must be dissipated. This is done mainly using heat sinks to increase the surface area which dissipates heat. For this task Finite Element Tool ANSYS is used to determine the thermal gradient and maximum value of temperature in heat sink. With these results from ANSYS an optimum area is added to increase the heat dissipation rate and also sharp points are designed in top edge of fins to increase the rate of heat transfer.

P. Ravichandran, L. C. Gokul

Heat Sink, CPU, Thermal Analysis.

  • Channamallikarjun, “Thermal Analysis Of Cpu With Variable Baseplate Heat - Sink Using CFD” in International Journal of Research in Engineering and Technology (2014), Volume. 3, Issue 3, pp. 510-515.
  • R.Mohan and Dr.P.Govindarajan, “Thermal Analysis of CPU with variable Heat Sink Base Plate Thickness using CFD “ International Journal of the Computer, the Internet and Management(2010), Vol. 18 No.1, pp 27-36 .
  • Heng Ren, “Thermal Design of a Cabinet With Heat Sinks  Using CFD Analysis “,International Journal of Science, Engineering and Technology Research (2015), Volume 4, Issue 7,  pp.2346-2350.
  • Santosh Kansal, Piyush Laad, “Performance & Thermal Analysis of Heat Sink with Fins of Different Configuration Using CFD” International Journal of Scientific & Engineering Research (2015), Volume 6, Issue 6, pp.1487-1495.
  • Hong-Sen Kou, Ji-Jen Lee & Chi-Yuan Lai, “Thermal Analysis and Optimum Fin Length of a Heat Sink “,Heat Transfer Engineering (2003), Volume 24, Issue 2, pp.18-29.
  • Seri Lee, “Optimum design and selection of heat sinks”,  Components, Packaging, and Manufacturing Technology, IEEE Transactions, Volume:18 ,  Issue: 4 , pp.812-817.
  • Bärwolff  , R. Puchert  , P. Enders , U. Menzel, D. Ackermann, “Analysis of thermal behaviour of high power semiconductor laser arrays by means of the finite element method (FEM)”,  Journal of thermal analysis, (1995), Volume 45, Issue 3, pp 417-436.

Publication Details

Published in : Volume 2 | Issue 1 | January-Febuary - 2016
Date of Publication Print ISSN Online ISSN
2016-02-29 2395-1990 2394-4099
Page(s) Manuscript Number   Publisher
432-437 IJSRSET1621115   Technoscience Academy

Cite This Article

P. Ravichandran, L. C. Gokul, "Thermal Analysis of Heat Sink in CPU with Varying Fin Designs", International Journal of Scientific Research in Science, Engineering and Technology(IJSRSET), Print ISSN : 2395-1990, Online ISSN : 2394-4099, Volume 2, Issue 1, pp.432-437, January-Febuary-2016.
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