Design and Performance Investigation of Binary Signed Digit Adder

Authors

  • Sharmila Hemanandh  ECE, JEPPIAAR SRR Engineering College , Chennai, Tamil Nadu, India
  • Aishwarya Gopinath   ECE, JEPPIAAR SRR Engineering College , Chennai, Tamil Nadu, India
  • S. Karthika  ECE, JEPPIAAR SRR Engineering College , Chennai, Tamil Nadu, India
  • B. Nandhini  ECE, JEPPIAAR SRR Engineering College , Chennai, Tamil Nadu, India

Keywords:

Fast Adders, CSA, CLA, BSD

Abstract

An Adder is a basic building block of a digital system. In general, an adder is a digital circuit that performs addition of numbers. Adders play a vital role in deciding the overall performance of digital signal processing applications. They are also utilized in other parts of the processor, where they are used to calculate addresses, table indices, increment and decrement operators etc. The type of number representation used in the design of adders influence the performance of the adder and hence the digital system. This paper proposes the design of Binary Signed Digit (BSD) adder based on signed digit number representation. Binary Signed Digit representation results in fast and propagation free addition. The carry free addition offers many advantages in the implementation of arithmetic circuits. The advantages and disadvantages of Fast adders such as Carry Save Adder (CSA) and Carry Look Ahead Adder (CLA) are studied. The adders are discussed and the performance parameters such as area and power are compared. The adders are designed using Xilinx and implemented with XC9572XL-5-TQ100.The results prove that the proposed Binary Signed Digit adder is highly efficient than the other two fast adders.

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Published

2017-04-30

Issue

Section

Research Articles

How to Cite

[1]
Sharmila Hemanandh, Aishwarya Gopinath , S. Karthika, B. Nandhini, " Design and Performance Investigation of Binary Signed Digit Adder, International Journal of Scientific Research in Science, Engineering and Technology(IJSRSET), Print ISSN : 2395-1990, Online ISSN : 2394-4099, Volume 3, Issue 2, pp.327-331, March-April-2017.