Optimization study on Electrical Enclosure with Forced Convection cooling using Computational Fluid Dynamics

Authors

  • Mohammed Nabeel Ahmed  UG Scholar, Department of Mechanical Engineering, New Horizon College of Engineering, Bangalore, India
  • B. Meghanath  UG Scholar, Department of Mechanical Engineering, New Horizon College of Engineering, Bangalore, India
  • Mayur Laxman Kesarkar  UG Scholar, Department of Mechanical Engineering, New Horizon College of Engineering, Bangalore, India
  • Lakshminarasimha. N  Assistant Professor, Department of Mechanical Engineering, New Horizon College of Engineering, Bangalore, India

DOI:

https://doi.org//10.32628/IJSRSET207219

Keywords:

CFD, Electrical enclosure, air flow requirement, optimization, temperature rise, ANSYS Fluent, heat dissipation.

Abstract

Any electronic walled in area comprises of heat creating electronic components, as heat produced by the electronic parts in a fenced in area decreases the life of electronic segments prompting serious harm or disappointment of the framework. Research shows that each 10°c rise above room temperature of the enclosure, the life of the electronic parts decreases. Thus for any electronic frameworks, cooling turns into a significant structure interest, practical and ideal answer for hold the electronic parts to its working limit. Therefore, in the present work CFD simulation has been carried out using ANSYS Fluent by considering a typical Aluminum Electrical enclosure of volume (150mm X 600mm X 250mm) with total internal heat dissipation of 84W. With those values into consideration the surface area of enclosure, enclosure temperature rise, air flow requirement in an enclosure is calculated and based on which the fan is selected. Also optimization study has been carried out by changing the inlet opening position, exhaust fan location and providing baffle at inlet opening location. The results obtained from analysis are validated with analytical results.

References

  1. R. Boukhanouf and A. Haddad., “A CFD Analysis of an electronics cooling enclosure for application in telecommunication systems”, “Applied Thermal Engineering-Elsevier”, volume 30, Issue 16, Nov. 2010, pp. 2426-2434, ISSN: 1359-4311.
  2. R. Mohan and Dr. P. Govindarajan., “Thermal Analysis of CPU with variable Heat Sink Base Plate Thickness using CFD”, “International Journal of the Computer, the Internet and Management”, Vol. 18, issue 1, Jan. 2010, pp. 27-36, ISSN: 0858-7027.
  3. Hoffman- A Pentair Company., “Heat dissipation in Electrical enclosure”, “Technical information on Thermal Management of Electrical enclosures”, 2003.
  4. Lakshminarasimha N., “Numerical Investigation of forced convection cooling of Electrical enclosure using CFD”, “Journal of Engineering Research and Applications”, Vol. 5, Issue 11, (Part - 5) Nov. 2015, pp.62-66, ISSN: 2248-9622

International Journal of Scientific Research in Science, Engineering and Technology

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Published

2020-04-30

Issue

Volume 7, Issue 2, March-April-2020

Section

Research Articles

License

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This work is licensed under a Creative Commons Attribution 4.0 International License.

How to Cite

[1]
Mohammed Nabeel Ahmed, B. Meghanath,Mayur Laxman Kesarkar, Lakshminarasimha. N, " Optimization study on Electrical Enclosure with Forced Convection cooling using Computational Fluid Dynamics, International Journal of Scientific Research in Science, Engineering and Technology(IJSRSET), Print ISSN : 2395-1990, Online ISSN : 2394-4099, Volume 7, Issue 2, pp.34-42, March-April-2020. Available at doi : https://doi.org/10.32628/IJSRSET207219