A Comprehensive Study of Efficient Thermal Management Techniques for Handheld Devices
Keywords:
VLSI, ULSI, MP-SoC, CEO, Dynamic Voltage and Frequency Scaling, Thermal Interface MaterialsAbstract
Modern research and development in computer technology has caused the electronics chips to shrink. The increasing needs for hand-held devices that use these VLSI & ULSI chips gave rise to new studies and developments. The increased demand for higher speed processing gave rise to clock speed of the CPU. Recent studies have found out that the failure rate in these chipsets is rising exponentially and is linked with the temperature variations caused by very large scale integration and reduces chip area. It is observed that the devices, currently in the market, heat rapidly. The traditional heat sink and cooling techniques fails to perform with these new devices. The need for a comprehensive study of electronic system design and thermal management in electronics devices is increasing. Study has revealed that miniaturization of the cooling mechanism, and the electronics components should go hand in hand. The study, research and implementation of the new thermal management or cooling techniques for various handheld electronic devices, is the need of the hour. In this paper, the author has explored various methods and effective thermal management schemes for handheld devices.
References
- Ronan Grimes, Ed Walsh, Pat Walsh. Active Cooling Of A Mobile Phone Handset. Applied Thermal Engineering, Elsevier, 2010, 30 (16), pp.2363. <10.1016/j.applthermaleng.2010.06.002>. <hal00675399>
- “High Power CSP Thermal ", Mingzong Wang, Eason Chen, Jeng Yuan Lai, Yu-Po Wang, IEEE 2007.
- Lee, J., 2009. Convection performance of nano?uids for electronics cooling. PhD thesis. Stanford University
- “High Power CSP Thermal ", Mingzong Wang, Eason Chen, Jeng Yuan Lai, Yu-Po Wang, IEEE 2007.
- A Figure of Merit for Smart Phone Thermal Management By Victor Chiriac, Steve Molloy, Jon Anderson1, Ken Goodson Qualcomm Technologies, Inc., Stanford Mechanical Engineering
- Thermal runaway of lithium-ion batteries and hazards of abnormal thermal environments by John C. Hewson1, Stefan P. Domino2, 1Fire Science and Technology Department 2Computational Thermal and Fluid Mechanics Department Sandia National Laboratories, Albuquerque, New Mexico, 87185-0836, USA
- Dynamic Thermal Management for High-Performance Microprocessors David Brooks Department of Electrical Engineering Princeton University
- Gochman, S., R. Ronen, I. Anati, A. Berkovits, T. Kurts, A. Naveh, A. Saeed, Z. Sperber, R. Valentine, 2003. The Intel Pentium M processor: microarchitecture and performance. IntTechnol, 7: 21-36.
- IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, VOL. 16, NO. 9, SEPTEMBER 2008, Static and Dynamic Temperature-Aware Scheduling for Multiprocessor SoCs Ays¸e K?v?lc?m Cos¸kun, Student Member, IEEE, Tajana Simunic ? ´ Rising, Member, IEEE, Keith A. Whisnant, Member, IEEE, and Kenny C. Gross, Member, IEEE
- The Power of Dynamic Voltage Frequency Scaling By Vinod Viswanath
- “Process Management and Process Migration” by Muthukumar
- Static and Dynamic Temperature-Aware Scheduling for Multiprocessor SoCs Ays¸e K?v?lc?m Cos¸kun, Student Member, IEEE, Tajana Simunic Rosing, Member, IEEE, Keith A. Whisnant, Member, IEEE, and Kenny C. Gross, Member, IEEE
- Thermal Herding: Microarchitecture Techniques for Controlling Hotspots in High-Performance 3D-Integrated ProcessorsKiran Puttaswamy Gabriel H. Loh, Georgia Institute of Technology,School of Electrical and Computer Engineering Computingkiranp@ece.gatech.edu
- http://vlsi-soc.blogspot.com/2012/08/clock-gating-integrated-cell.html
- Three-dimensional integration of nanotechnologies for computing and data storage on a single chip by Max M. Shulaker, Gage Hills, Rebecca S. Park, Roger T. Howe, Krishna Saraswat, H.-S. Philip Wong & Subhasish Mitra
- A REVIEW OF CLOCK GATING TECHNIQUES by Jagrit Kathuria, M.Ayoubkhan and Arti Noor Marilyn
- Wolf, in Computers as Components (Fourth Edition), 2017
- "A 1.6 GHz Quad-Core Application Processor Manufactured in 32 nm High-k Metal Gate Process for Smart Mobile Devices", Se-Hyun Yang, Jungyul Pyo, Youngmin Shin, and Jae Cheol Son, TOPICS IN INTEGRATED CIRCUITS FOR COMMUNICATIONS IEEE Communications Magazine April 2013
- “PARAMETRIC THERMAL MODELING OF HEAT TRANSFER IN HANDHELD ELECTRONIC DEVICES”, Jaeho Lee, David W. Gerlach, and Yogendra K. Joshi, IEEE 2008. Design Guidelines for a Piezoelectric Micro- Blower Fansink.
- http://www.dupont.com/corporate-functions/media-center/featured-stories/november-2016/phone-cool-temprion.html
- Design Guidelines for a Piezoelectric Micro- Blower Fansink By Fukue Takashi, Thermal Engineering Laboratory (Hirose - Fukue Gr.) Assistant Professor, National University Corporation Iwate University Faculty of Engineering, Department of Mechanical Systems Engineering
- ACM Transactions on Architecture and Code Optimization, Vol. 1, No. 1, March 2004. The Truth About Processor "Degradation", Intel's 45nm Dual-Core E8500: The Best Just Got Better by Kris Boughton on March 5, 2008
- The Truth About Processor "Degradation", Intel's 45nm Dual-Core E8500: The Best Just Got Better by Kris Boughton on March 5, 2008
- “COIN INSERTION TECHNOLOGY FOR PCB THERMAL SOLUTION”, Chien-Cheng Lee, Wu-Yung Chen,
- "THERMAL TESTS AND ANALYSIS OF THIN GRAPHITE HEAT SPREADER FOR HOT SPOT REDUCTION IN HANDHELD DEVICES", Yin Xiong, Martin Smalc, Julian Norley, John Chang, Helen Mayer, Prathib Skandakumaran, Brad Reis, IEEE 2008.
- https://www.gabrian.com/6-heat-sink-types
- "Dynamics and Topology Optimization of Piezoelectric Fans", Philipp Bürmann, Arvind Raman, and Suresh V. Garimella, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 25, NO. 4, DECEMBER 2003.
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